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MIPI ® DSI host controller supporting up to 720p 30 Hz resolution.

LCD-TFT controller supporting up to XGA resolution.

Chrom-ART Accelerator (DMA2D), graphical hardware accelerator enabling enhanced graphical user interface.

Flexible external memory controller with up to 32-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, NOR/NAND memories.

SRAM: 512 Kbytes (including 128 Kbytes of data TCM RAM for critical real-time data) + 16 Kbytes of instruction TCM RAM (for critical real-time routines) + 4 Kbytes of backup SRAM.

Up to 2 Mbytes of Flash memory organized into two banks allowing read-while-write.

Core: Arm ® 32-bit Cortex ®-M7 CPU with DPFPU, ART Accelerator and L1-cache: 16 Kbytes I/D cache, allowing 0-wait state execution from embedded Flash and external memories, up to 216 MHz, MPU, 462 DMIPS/2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions.

Includes ST state-of-the-art patented technology.

Mobile applications, Internet of Things Alarm systems, video intercom, and HVAC Industrial applications: PLC, inverters, circuit breakers These features make the STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx microcontrollers suitable for a wide range of applications: The set of included peripherals changes with the device chosen. The STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx devices offer devices in 11 packages ranging from 100 pins to 216 pins.

A comprehensive set of power-saving mode allows the design of low-power applications. The supply voltage can drop to 1.7 V with the use of an external power supply supervisor. Dedicated supply inputs for USB (OTG_FS and OTG_HS) and SDMMC2 (clock, command and 4-bit data) are available on all the packages except LQFP100 for a greater power supply choice. The STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx devices operate in the –40 to +105 ☌ temperature range from a 1.7 to 3.6 V power supply. An USB OTG full-speed and a USB OTG high-speed with full-speed capability (with the ULPI)Īdvanced peripherals include two SDMMC interfaces, a flexible memory control (FMC) interface, a Quad-SPI Flash memory interface, a camera interface for CMOS sensors. To achieve audio class accuracy, the I2S peripherals can be clocked via a dedicated internal audio PLL or via an external clock to allow synchronization. Six SPIs, three I2Ss in half-duplex mode. They also feature standard and advanced communication interfaces:

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The STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx devices incorporate high-speed embedded memories with a Flash memory up to 2 Mbytes, 512 Kbytes of SRAM (including 128 Kbytes of Data TCM RAM for critical real-time data), 16 Kbytes of instruction TCM RAM (for critical real-time routines), 4 Kbytes of backup SRAM available in the lowest power modes, and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses, a 32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal and external memories access.Īll the devices offer three 12-bit ADCs, two DACs, a low-power RTC, twelve general-purpose 16-bit timers including two PWM timers for motor control, two general-purpose 32-bit timers, a true random number generator (RNG).

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It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances the application security. The Cortex ®-M7 core features a floating point unit (FPU) which supports Arm ® double-precision and single-precision data-processing instructions and data types. The STM32F765xx, STM32F767xx, STM32F768Ax and STM32F769xx devices are based on the high-performance Arm ® Cortex ®-M7 32-bit RISC core operating at up to 216 MHz frequency.